Laser singulation of silicon wafers

Overview

Laser dicing is an alternative to the conventional technique of using diamond saw for singulation of silicon wafers. Current trends are moving towards the use of thinner wafers. Although laser dicing is an effective solution to this problem, it often creates molten debris and heat induced stress.

Our patented process aims to eliminate all the issues mentioned above through the use of laser thermal melting to induce directional crack propagation for chips singulation.

Our Innovation

Our technology is unique in that it only requires a single pass scan. This method of wafer singulation does not require assisting fluids. It is also able to do so while still achieving almost zero kerf width. Additionally, this process of cutting only causes minimal debris on the wafer surface. The resultant wafers have had Heat Affected Zone Studies and Die Strength Tests done and successfully passed as well.

Potential Applications

The potential applications of this technology are primarily for the dicing or singulation of silicon wafers. As such, the applications of this technology would see the most use in manufacturing sectors, particularly those employing the use of silicon wafers. These sectors would include the electronics industry, primarily for the growing sectors of semiconductors used in most electronic devices. 

Our Value Proposition

The semiconductor industry manufactures multi-billions of integrated circuits (IC) chips yearly. The current trend is for wafer thickness to move towards being 100um and below.

Using this technology, customers can expect:

• Much faster dicing speed and higher yield compared to diamond sawing
• Small kerf width and minimal debris

As such, we are actively looking for interested companies to co-develop this technology.